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Modeling and Simulation for Microelectronic Packaging Assembly

- Manufacturing, Reliability and Testing

af Yong Liu, Shen (Huazhong University of Science and Technology Liu
Modeling and Simulation for Microelectronic Packaging Assembly af Yong Liu
Bag om Modeling and Simulation for Microelectronic Packaging Assembly

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780470827802
  • Indbinding:
  • Hardback
  • Sideantal:
  • 576
  • Udgivet:
  • 21. Oktober 2011
  • Størrelse:
  • 175x252x36 mm.
  • Vægt:
  • 1134 g.
  • 2-3 uger.
  • 9. Oktober 2024

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Abonnementspris

- Rabat på køb af fysiske bøger
- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding

Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.

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Beskrivelse af Modeling and Simulation for Microelectronic Packaging Assembly

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

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