Hybrid photonic assemblies based on 3D-printed coupling structures
- Indbinding:
- Paperback
- Sideantal:
- 292
- Udgivet:
- 24. april 2023
- Størrelse:
- 148x19x210 mm.
- Vægt:
- 426 g.
- 2-15 hverdage.
- 10. december 2024
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Beskrivelse af Hybrid photonic assemblies based on 3D-printed coupling structures
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
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