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Hybrid photonic assemblies based on 3D-printed coupling structures

Bag om Hybrid photonic assemblies based on 3D-printed coupling structures

Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9783731512738
  • Indbinding:
  • Paperback
  • Sideantal:
  • 292
  • Udgivet:
  • 24. april 2023
  • Størrelse:
  • 148x19x210 mm.
  • Vægt:
  • 426 g.
  • 2-15 hverdage.
  • 10. december 2024
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Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).

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