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Testing of Interposer-Based 2.5D Integrated Circuits

af Krishnendu Chakrabarty, Ran Wang
Testing of Interposer-Based 2.5D Integrated Circuits af Krishnendu Chakrabarty
Bag om Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9783319854618
  • Indbinding:
  • Paperback
  • Sideantal:
  • 182
  • Udgivet:
  • 9. maj 2018
  • Udgave:
  • 12017
  • Størrelse:
  • 155x235x0 mm.
  • Vægt:
  • 3051 g.
  • 8-11 hverdage.
  • 27. november 2024

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The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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