De Aller-Bedste Bøger - over 12 mio. danske og engelske bøger
Levering: 1 - 2 hverdage

Testing of Interposer-Based 2.5D Integrated Circuits

Bag om Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

Vis mere
  • Sprog:
  • Engelsk
  • ISBN:
  • 9783319547138
  • Indbinding:
  • Hardback
  • Sideantal:
  • 182
  • Udgivet:
  • 29. marts 2017
  • Udgave:
  • 12017
  • Størrelse:
  • 235x155x13 mm.
  • Vægt:
  • 4203 g.
  • 8-11 hverdage.
  • 7. december 2024
På lager

Normalpris

Abonnementspris

- Rabat på køb af fysiske bøger
- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding

Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.

Beskrivelse af Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

Brugerbedømmelser af Testing of Interposer-Based 2.5D Integrated Circuits



Find lignende bøger
Bogen Testing of Interposer-Based 2.5D Integrated Circuits findes i følgende kategorier: