De Aller-Bedste Bøger - over 12 mio. danske og engelske bøger
Levering: 1 - 2 hverdage
Hjælp
Login
  1. Forside
  2. Bøger
  3. Business og læring
  4. Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

af Gerard Kelly
Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages af Gerard Kelly
Bag om Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.

Vis mere
  • Sprog:
  • Engelsk
  • ISBN:
  • 9780792384854
  • Indbinding:
  • Hardback
  • Sideantal:
  • 134
  • Udgivet:
  • 30. april 1999
  • Udgave:
  • 1999
  • Størrelse:
  • 244x170x11 mm.
  • Vægt:
  • 910 g.
  • 8-11 hverdage.
  • 16. januar 2025

Normalpris

Abonnementspris

- Rabat på køb af fysiske bøger
- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding

Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.

Bag om Gerard Kelly

Vis alle bøger af Gerard Kelly

Beskrivelse af Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.

Brugerbedømmelser af Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages



Andre købte også..
Find lignende bøger
Bogen Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages findes i følgende kategorier: