De Aller-Bedste Bøger - over 12 mio. danske og engelske bøger
Levering: 1 - 2 hverdage

Sic Power Module Design: Performance, Robustness and Reliability

Bag om Sic Power Module Design: Performance, Robustness and Reliability

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.

Vis mere
  • Sprog:
  • Engelsk
  • ISBN:
  • 9781785619076
  • Indbinding:
  • Hardback
  • Sideantal:
  • 360
  • Udgivet:
  • 3. februar 2022
  • Størrelse:
  • 160x25x239 mm.
  • Vægt:
  • 662 g.
  • 2-3 uger.
  • 2. december 2024
På lager

Normalpris

Abonnementspris

- Rabat på køb af fysiske bøger
- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding

Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.

Beskrivelse af Sic Power Module Design: Performance, Robustness and Reliability

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.

Brugerbedømmelser af Sic Power Module Design: Performance, Robustness and Reliability



Find lignende bøger