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Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfacesaf Nicole Lindenmann
Bag om Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9783731507468
  • Indbinding:
  • Paperback
  • Sideantal:
  • 256
  • Udgivet:
  • 12. februar 2018
  • Størrelse:
  • 148x16x210 mm.
  • Vægt:
  • 376 g.
  • 2-3 uger.
  • 2. december 2024
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Beskrivelse af Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

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