Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
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- Indbinding:
- Paperback
- Sideantal:
- 256
- Udgivet:
- 12. februar 2018
- Størrelse:
- 148x16x210 mm.
- Vægt:
- 376 g.
- 2-3 uger.
- 2. december 2024
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- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding
Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.
Beskrivelse af Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
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