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  5. New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

af Nabil Shovon Ashraf, Shawon Alam, Mohaiminul Alam

indgår i Synthesis Lectures on Emerging Engineering Technologies serien

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation af Nabil Shovon Ashraf
Bag om New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9783031008993
  • Indbinding:
  • Paperback
  • Sideantal:
  • 84
  • Udgivet:
  • 16. februar 2016
  • Størrelse:
  • 191x6x235 mm.
  • Vægt:
  • 176 g.
  • 8-11 hverdage.
  • 10. december 2024
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In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

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