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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

- Ceramic research and development in Japan

af K. Otsuka
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module af K. Otsuka
Bag om Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781851665792
  • Indbinding:
  • Hardback
  • Sideantal:
  • 242
  • Udgivet:
  • 30. april 1993
  • Størrelse:
  • 254x178x16 mm.
  • Vægt:
  • 1200 g.
  • 8-11 hverdage.
  • 7. december 2024

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This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

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