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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

- Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.

indgår i MRS Proceedings serien

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
Bag om Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990

This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781107408715
  • Indbinding:
  • Paperback
  • Sideantal:
  • 358
  • Udgivet:
  • 5. juni 2014
  • Størrelse:
  • 152x229x19 mm.
  • Vægt:
  • 48 g.
  • 8-11 hverdage.
  • 11. december 2024
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Forlænget returret til d. 31. januar 2025

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This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

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