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Heat Management in Integrated Circuits

- On-chip and system-level monitoring and cooling

af Northwestern University, USA) Ogrenci-Memik, Seda (Associate Professor, Electrical Engineering and Computer Science Department

indgår i Materials, Circuits and Devices serien

Heat Management in Integrated Circuits af Northwestern University
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This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781849199346
  • Indbinding:
  • Hardback
  • Sideantal:
  • 264
  • Udgivet:
  • 1. december 2015
  • Størrelse:
  • 165x245x20 mm.
  • Vægt:
  • 564 g.
  • 8-11 hverdage.
  • 21. november 2024
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This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

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