Force Sensors for Microelectronic Packaging Applications
indgår i Microtechnology and MEMS serien
- Indbinding:
- Paperback
- Sideantal:
- 178
- Udgivet:
- 22. oktober 2010
- Udgave:
- 12005
- Størrelse:
- 234x156x10 mm.
- Vægt:
- 296 g.
- 8-11 hverdage.
- 11. december 2024
På lager
Forlænget returret til d. 31. januar 2025
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- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding
Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.
Beskrivelse af Force Sensors for Microelectronic Packaging Applications
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
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