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Electronic Packaging Materials and Their Properties

af Michael (University of Maryland Pecht

indgår i Electronic Packaging serien

Electronic Packaging Materials and Their Properties af Michael (University of Maryland Pecht
Bag om Electronic Packaging Materials and Their Properties

Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780849396250
  • Indbinding:
  • Hardback
  • Sideantal:
  • 120
  • Udgivet:
  • 18. december 1998
  • Størrelse:
  • 156x234x12 mm.
  • Vægt:
  • 354 g.
  • 8-11 hverdage.
  • 9. december 2024

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Abonnementspris

- Rabat på køb af fysiske bøger
- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding

Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.

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Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

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