Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613

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Paperback
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338,95 kr.

Bag om Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.

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Sprog:
Engelsk

ISBN:
9781107413146

Forlag:
Cambridge University Press

Indbinding:
Paperback

Sideantal:
176

Udgivet:
5. juni 2014

Størrelse:
152x229x10 mm.

Vægt:
24 g.

Leveringstid: 8-11 hverdage.
Forventet levering: 11. december 2024

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Forlænget returret til d. 31. januar 2025

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Beskrivelse af Chemical-Mechanical Polishing 2000 - Fundamentals and Materials Issues: Volume 613

Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.

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