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Bonding in Microsystem Technology

af Jan A. Dziuban

indgår i Springer Series in Advanced Microelectronics serien

Bonding in Microsystem Technology af Jan A. Dziuban
Bag om Bonding in Microsystem Technology

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9789048171514
  • Indbinding:
  • Paperback
  • Sideantal:
  • 334
  • Udgivet:
  • 23. november 2010
  • Udgave:
  • 12006
  • Størrelse:
  • 234x156x18 mm.
  • Vægt:
  • 539 g.
  • 8-11 hverdage.
  • 10. december 2024
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This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.

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