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Advanced Materials for Thermal Management of Electronic Packaging

af Ph.D. Tong, Xingcun Colin

indgår i Springer Series in Advanced Microelectronics serien

Advanced Materials for Thermal Management of Electronic Packaging af Ph.D. Tong
Bag om Advanced Materials for Thermal Management of Electronic Packaging

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781461427926
  • Indbinding:
  • Paperback
  • Sideantal:
  • 618
  • Udgivet:
  • 25. februar 2013
  • Udgave:
  • 2011
  • Størrelse:
  • 243x236x31 mm.
  • Vægt:
  • 946 g.
  • 8-11 hverdage.
  • 10. december 2024
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Beskrivelse af Advanced Materials for Thermal Management of Electronic Packaging

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.

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