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  5. 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

af Lih-Tyng Hwang

indgår i Wiley - IEEE serien

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility af Lih-Tyng Hwang
Bag om 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab * Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail * Provides chapter-wise review questions and powerpoint slides as teaching tools

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781119289647
  • Indbinding:
  • Hardback
  • Sideantal:
  • 464
  • Udgivet:
  • 19. juni 2018
  • Størrelse:
  • 168x239x28 mm.
  • Vægt:
  • 839 g.
  • Ukendt - mangler pt..

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Beskrivelse af 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
* Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
* Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
* Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
* Provides chapter-wise review questions and powerpoint slides as teaching tools

Brugerbedømmelser af 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility



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