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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

- A Focus on Reliability

Bag om Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780471594468
  • Indbinding:
  • Hardback
  • Sideantal:
  • 464
  • Udgivet:
  • 16. marts 1994
  • Størrelse:
  • 163x238x31 mm.
  • Vægt:
  • 840 g.
  • 8-11 hverdage.
  • 6. marts 2025

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- Rabat på køb af fysiske bøger
- 1 valgfrit digitalt ugeblad
- 20 timers lytning og læsning
- Adgang til 70.000+ titler
- Ingen binding

Abonnementet koster 75 kr./md.
Ingen binding og kan opsiges når som helst.

Beskrivelse af Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals.

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