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  • - Science and Technology
    af Q.-Y. (Duke University Tong & U. (Max-Planck-Institute of Microstructure Physics Goesele
    1.989,95 kr.

    Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.