Bøger af Michael G. Pecht

This book describes the use of free air cooling to improve efficiency and cooling of equipment used in telecom infrastructures such as data centers or base stations. Proposes a new free air cooling method that uses prognostics and health management (PHM).

Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.

The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems.

* Chapter 1 provides a basic understanding of PHM and the techniques being developed to enable prognostics for electronic products and systems. * Chapter 2 presents the state of the art in sensor systems for in-situ health and usage monitoring. * Chapter 3 discusses the various models and algorithms that can be utilized for PHM.